Small Outline Package, Our packages .

Small Outline Package, In packages with a pin pitch of 1. 0mm. However, the SOIC features 1. SOIC is also sometimes referred to as " Small Outline L-leaded package (SOL) " or " SO ". Nov 2, 2023 · The Small Outline Integrated Circuit Package (SOIC) is a type of surface-mount integrated circuit (SMD) with a rectangular shape, featuring pins that protrude from both sides. These variants come with different structural measurements. 8mm to 12x20mm. Feb 10, 2024 · The Small Outline Integrated Circuit (SOIC) package is a type of surface-mount IC package that is widely used in the electronics industry. SOIC is available in various types which include the small outline J-leaded packages (SOJ), the small mini outlines package (MSOP), the shrink small outlines packages (SSOP), and the small thin outline integrated circuit package (TSOP). Jan 5, 2024 · Here we explained what IC packaging is and the different types of IC Packages like DIP, QFP, BGA, SOP, SMD, QFN, SOIC, and SOT. Small-outline (SO) packages include a dual row surface mount configuration with a wide variety of sizes and variations including SOIC, SOT, and all SOP spins (SSOP, TSSOP, VSSOP/MSOP). May 31, 2023 · SOP stands for Small Outline Package and is a compact and thin integrated circuit package for electronic components. With electronics transitioning to smaller sizes and higher component density on printed circuit boards, SOIC packaging has become one of the enabling technologies. 25mm lead spacing . Variants include the thin small outline package (TSOP) and thin-shrink small outline package (TSSOP). . It was first introduced by the electronics company Texas Instruments in 1985. Type I TSOPs have the leads protruding from the width portion of the package. These leads, in turn, are used for soldering to the PCB pads. Jun 19, 2025 · SOIC/SOP (Small Outline Integrated Circuit/Small Outline Package) – Small Outline IC Package SOIC is one of the most common surface-mount packages, featuring leads on both sides. High utilization across many industries and high reliablity makes this a standard package well-suited for numerous applications, including automotive and industrial. Lead counts range from 28 to 48. Aug 3, 2020 · Learn about the vast range of small outline packages (SOPs) from Diodes that can help you maximize system performance without compromising on form-factor. Small Outline Integrated Circuit (SOIC) Package Specifications Understanding the precise physical attributes of the SOIC is critical for PCB layout and assembly. Our packages Thin Small Outline Packages (TSOP) are thin body size components; thickness is 1. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. Read our definitions for common package groups, families and preference codes, along with other important terminology when evaluating our packaging options. Jan 27, 2021 · SO、SOP、SOIC封装详解(关于宽体、中体、窄体) 第一篇 一、简介 SOP（ Small Outline Package ）小外形封装，指鸥翼形 (L 形 )引线从封装的两个侧面引出的一 种表面贴装型封装。 1968 ～ 1969 年飞利浦公司就开发出小外形封装（ SOP）。 Jul 9, 2025 · The Small Outline Integrated Circuit (SOIC) package is one of the most popular and widely used surface mount package types in integrated circuits. 27mm, those with a JEITA standard are Small Outline Package (SOP) and those with a JEDEC standard are Small Outline Integrated Circuit (SOIC). Package body size ranges from 8x11. Note that the pin pitch is the same, but the package body width is different. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. Our package options range from traditional leaded and leadless packages (small outline package (SOP), quad flat package (QFP) and quad flat no-lead (QFN)) to advanced ball grid arrays using wire bond and flip-chip interconnects and wafer-level packages. Packages are available with or without an Jul 30, 2020 · Small Outline Integrated Circuit SOICs are small, rectangular IC packages that have gull-wing leads that extend from the two longer edges and have pin counts of 14 or more. A Small Outline Integrated Circuit (SOIC) chip mounted on a printed circuit board showing gull-wing leads and pin configuration. TSOP packages have four sides and are rectangular. Learn about the different kinds of SOP packages, their pin counts, sizes, differences with SOIC packages, and benefits for various industries. We offer customers a broad integrated circuit (IC) packaging portfolio enabled by years of engineering innovation and expertise. jydcqu, 281czq, oixvof3, hpyl, pz7m, j06bslc, 6qy, r2xkqt, h3ccmq, q7,